Liquid discharge head, liquid discharge device, and liquid discharge apparatus

ABSTRACT

A liquid discharge head includes a body to discharge liquid, a first wiring substrate extending from the body, and a second wiring substrate electrically connected to the first wiring substrate. The body includes a nozzle face in which a plurality of nozzles, from which the liquid is discharged, is formed. The second wiring substrate is disposed along a direction perpendicular to the nozzle face of the body, a principal surface of the first wiring substrate is disposed along a short side of the body, and a principal surface of the second wiring substrate is disposed along a longitudinal direction of the body.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a continuation of U.S. patent application Ser. No. 15/799,325filed Oct. 31, 2017, which is based on and claims priority pursuant to35 U.S.C. § 119(a) to Japanese Patent Application No. 2016-225503 filedNov. 18, 2016, in the Japan Patent Office and Japanese PatentApplication No. 2017-177626 filed Sep. 15, 2017, in the Japan PatentOffice, the entire contents of each of which are incorporated herein byreference.

BACKGROUND Technical Field

Aspects of this disclosure relate to a liquid discharge head, a liquiddischarge device, and a liquid discharge apparatus.

Related Art

A liquid discharge head includes a wiring substrate to supply drivesignals to a pressure generator and a connector to connect the wiringsubstrate to a wiring substrate disposed outside the liquid dischargehead.

A flexible substrate is pulled out from a body of the liquid dischargehead so that a principal surface of the flexible substrate is along alongitudinal direction of the body. The flexible substrate is connectedto a circuit substrate while facing the circuit substrate. A principalsurface of the circuit substrate is arranged along the longitudinaldirection of the body

A flexible substrate may be pulled out from one end of the body in alongitudinal direction of the body so that a principal surface of theflexible substrate is along a short side of the body.

SUMMARY

In an aspect of this disclosure, a novel liquid discharge head includesa body to discharge liquid, a first wiring substrate extending from thebody, and a second wiring substrate electrically connected to the firstwiring substrate. The body includes a nozzle face in which a pluralityof nozzles, from which the liquid is discharged, is formed. The secondwiring substrate is disposed along a direction perpendicular to thenozzle face of the body, a principal surface of the first wiringsubstrate is disposed along a short side of the body, and a principalsurface of the second wiring substrate is disposed along a longitudinaldirection of the body.

In another aspect of this disclosure, a liquid discharge device includesthe liquid discharge head.

In still another aspect of this disclosure, a liquid discharge apparatusincludes the liquid discharge device.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The aforementioned and other aspects, features, and advantages of thepresent disclosure will be better understood by reference to thefollowing detailed description when considered in connection with theaccompanying drawings, wherein:

FIG. 1 is a perspective view of a liquid discharge head according to afirst embodiment of the present disclosure;

FIG. 2 is a side view seen from a short side of the liquid dischargehead;

FIG. 3 is a plan view of the liquid discharge head;

FIG. 4 is an exploded perspective view of the body;

FIG. 5 is a perspective view of a liquid discharge head according to asecond embodiment of the present disclosure;

FIG. 6 is a side view seen from a short side of the liquid dischargehead;

FIG. 7 is a perspective view of a liquid discharge head according to athird embodiment of the present disclosure;

FIG. 8 is a perspective view of a liquid discharge head according to afourth embodiment of the present disclosure;

FIG. 9 is a perspective view of a liquid discharge head according to afifth embodiment of the present disclosure;

FIG. 10 is a cross-sectional view of a leading portion of a first wiringsubstrate;

FIG. 11 is a perspective view of a liquid discharge head according to asixth embodiment of the present disclosure;

FIG. 12 is a cross-sectional view of a main portion of a liquiddischarge head according to a seventh embodiment of the presentdisclosure;

FIG. 13 is a perspective view of a liquid discharge head according to aneighth embodiment of the present disclosure;

FIG. 14 is a perspective view of a liquid discharge head according to aninth embodiment of the present disclosure;

FIG. 15 is a perspective view of an example of a body according to aninth embodiment of the present disclosure;

FIG. 16 is a cross-sectional view of the body along a directionperpendicular to a nozzle array of the body;

FIG. 17 is an enlarged cross-sectional view of a main portion of thebody;

FIG. 18 is a cross-sectional view of a main portion of the body alongthe nozzle array;

FIG. 19 is a perspective view of a liquid discharge head according to atenth embodiment of the present disclosure;

FIGS. 20A and 20B are a plan view and a cross-sectional view of a framemember in the tenth embodiment;

FIGS. 21A and 21B are a plan view and a cross-sectional view of theframe member where wiring substrates are disposed on the frame member;

FIGS. 22A and 22B are a plan view and a cross-sectional view of a framemember according to an eleventh embodiment of the present disclosure;

FIGS. 23A and 23B are a plan view and a cross-sectional view of theframe member where wiring substrates are disposed on the frame member;

FIG. 24 is a perspective view of a liquid discharge head according to atwelfth embodiment of the present disclosure;

FIG. 25 is a plan view of a portion of a liquid discharge apparatusaccording to an embodiment of the present disclosure;

FIG. 26 is a side view of a portion of the liquid discharge apparatus;

FIG. 27 is a plan view of an example of a portion of a liquid dischargedevice; and

FIG. 28 is a front view of another example of the liquid dischargedevice; The accompanying drawings are intended to depict embodiments ofthe present disclosure and should not be interpreted to limit the scopethereof. The accompanying drawings are not to be considered as drawn toscale unless explicitly noted.

DETAILED DESCRIPTION

In describing embodiments illustrated in the drawings, specificterminology is employed for the sake of clarity. However, the disclosureof this patent specification is not intended to be limited to thespecific terminology so selected and it is to be understood that eachspecific element includes all technical equivalents that have the samefunction, operate in a similar manner, and achieve similar results.

Although the embodiments are described with technical limitations withreference to the attached drawings, such description is not intended tolimit the scope of the disclosure and all of the components or elementsdescribed in the embodiments of this disclosure are not necessarilyindispensable. As used herein, the singular forms “a”, “an”, and “the”are intended to include the plural forms as well, unless the contextclearly indicates otherwise.

Referring now to the drawings, wherein like reference numerals designateidentical or corresponding parts throughout the several views,embodiments of the present disclosure are described below.

FIGS. 1 to 3 illustrate a head 404 according to a first embodiment ofthe present disclosure. Hereinafter, the head 404 is simply referred toas “head 404”.

FIG. 1 is a perspective view of the head 404 according to an embodimentof the present disclosure.

FIG. 2 is a side view seen from a short side of the head 404.

FIG. 3 is a plan view of the head 404.

The liquid discharge head 404 includes a body 201, a first wiringsubstrate 211, and a second wiring substrate 212. The body 201discharges liquid from nozzles 4 formed on a nozzle face la of the head404. The first wiring substrate 211 extends from the slit (opening) 202and communicates with an interior of the body 201. The second wiringsubstrate 212 is arranged along a direction perpendicular to a surfaceof the nozzle face 1 a of the body 201 (indicated by arrow “Z” in FIGS.1 and 2). The second wiring substrate 212 is electrically connected tothe first wiring substrate 211. Hereinafter, “the liquid discharge head”is simply referred to as “head”.

In the present embodiment, a flexible wiring board (FPC) is used for thefirst wiring substrate 211 and a printed circuit board (PCB) is used forthe second wiring substrate 212.

A principle surface of the first wiring substrate 211 is arranged alongthe short side (indicated by an arrow “X” in FIGS. 1 and 2) of the body201. The first wiring substrate 211 is extending from a slit 202 formedat one end portion in a longitudinal direction (indicated by an arrow“Y” in FIG. 1) of the body 201. The first wiring substrate 211 isconnected to a wiring pattern of a pressure generator and a driverintegrated circuit (driver IC) in the body 201.

A principle surface of the second wiring substrate 212 is disposed alonga longitudinal direction of the body 201. A connector 214 is mounted onthe second wiring substrate 212 such that a terminal array of theconnector 214 is disposed in a direction along the longitudinaldirection of the body 201. The connector 214 is connectable with aconnector. This connector is provided on a wiring member that isconnected to a host apparatus and transmits a signal such as a controlsignal or a drive signal.

The first wiring substrate 211 includes a bend 213 in which an extensiondirection of a wiring pattern 215 is changed from the directionperpendicular to the surface of the nozzle face 1 a (extendingdirection) to the direction along the short side (indicated by an arrow“X” in FIGS. 1 and 2) of the body 201. A leading end 213 a of the bend213 is bent toward a direction along the longitudinal direction of thebody 201 and is connected to the second wiring substrate 212 whilefacing the second wiring substrate 212.

The first wiring substrate 211 thus shaped is formed by bending a pulledout side (extending side) of the first wiring substrate 211 intosubstantially an L-shaped member. The wiring pattern 215 may extendobliquely from the slit 202 toward a connecting portion of the secondwiring substrate 212 at the bend 213. The connecting portion is formedon a surface of the second wiring substrate 212 facing the first wiringsubstrate 211.

To connect the bend 213 of the first wiring substrate 211 and the secondwiring substrate 212, a connector, an anisotropic conductive film (ACF),non-conductive paste (NCP), a solder connection, metal diffusionbonding, or wire bonding may be applied.

In this way, the first wiring substrate 211 connected inside the body201 is extending from an end of the body in the longitudinal directionof the body 201. Thereby, the present embodiment can reduce a size ofthe body 201 in a direction perpendicular to the nozzle array of thehead 404 (short side indicated by arrow X) even when signalscorresponding to a plurality of nozzle arrays and power supply aresupplied to the body 201. Thus, the head 404 can be miniaturized.

As described in FIG. 4 below, a plurality of rows (two rows in FIG. 4)of actuators including piezoelectric elements 11 is provided on anactuator substrate 20 in the body 201. A control-signal wiring patternof a driver integrated circuit (IC) 500 to which a wiring pattern drawnfrom each row of actuators is connected and a drive source wiringpattern of the actuators are aggregated at an end part of the actuatorsubstrate 20 in the nozzle array. In a part where the wiring patternsare aggregated, the first wiring substrate 211 is connected to eachwiring pattern. Thereby, one first wiring substrate 211 can supplysignals and drive source to the plurality rows of the actuators. Thus,it becomes easier to draw the first wiring substrate 211 from the body201 and expertize a miniaturization of the head 404 in a width directionof the head 404.

A principal surface of the second wiring substrate 212 is disposed alonga longitudinal direction of the body 201. The second wiring substrate212 connects the body 201 to outside the body 201. The presentembodiment thus can widen a width of the second wiring substrate 212 toa width of the body 201 in the longitudinal direction. Thus, the secondwiring substrate 212 can mount a connector with a large number of pins.

Therefore, it is possible to avoid enlarging the body 201 and widen awiring substrate to be connected to outside.

An example of the body 201 is described with reference to FIG. 4.

FIG. 4 is an exploded perspective view of the body 201.

As illustrated in FIG. 4, the body 201 includes a nozzle plate 1, anactuator substrate 20, a holding substrate 50, and a common-chambersubstrate 70.

Two rows of nozzle arrays are formed on the nozzle plate 1. Each nozzlearrays includes a plurality of nozzles 4 arrayed in the longitudinaldirection Y (nozzle array) of the body 201.

The actuator substrate 20 includes an individual channel andpiezoelectric elements 11 as a pressure generating element. The holdingsubstrate 50 is connected to the actuator substrate 20. Thecommon-chamber substrate 70 forms a common liquid chamber 10. Thecommon-chamber substrate 70 also serves as a frame member of the body201.

The holding substrate 50 includes openings 51 serves as a part of acommon liquid chamber 10. The actuator substrate 20 includes openings 9communicating the openings 51 of the holding substrate 50 with theindividual liquid chambers 6 in the body 201. The common-chambersubstrate 70 includes a liquid supply port 71 for supplying the liquidto the opening 51 of the holding substrate 50 from outside the body 201.

The driver IC 500 to drive the piezoelectric element 11 is mounted onthe actuator substrate 20. The actuator substrate 20 includes aconnection wiring pattern 18 on an end of the actuator substrate 20 in alongitudinal direction of the actuator substrate 20. The connectionwiring pattern 18 is connected to the driver IC 500. Then, the firstwiring substrate 211 is connected to this connection wiring pattern 18.The connection wiring pattern 18 and the wiring pattern 215 of the firstwiring substrate 211 may be connected with wiring bonding.

A slit 202 is provided at an end in a longitudinal direction of thecommon-chamber substrate 70 of the body 201. The first wiring substrate211 connected to the actuator substrate 20 is pulled out (extends)through the slit 202.

FIGS. 5 and 6 illustrate the head 404 according to a second embodimentof the present disclosure.

FIG. 5 is a perspective view of the head 404 according to the presentembodiment. FIG. 6 is a side view seen from a short side (X direction)of the head 404.

The first wiring substrate 211 includes a bend 213 in which an extensiondirection of a wiring pattern 215 is changed from the directionperpendicular to the surface of the nozzle face 1 a to the directionalong the short side (indicated by an arrow “X” in FIGS. 5 and 6) of thebody 201. A portion of the first wiring substrate 211 extending from theslit 202 of the body 201 is bended along a short side (X direction) ofthe body 201. This bended portion of the first wiring substrate 211forms the bend 213. The leading end 213 a of the bend 213 is bent towarda direction along the longitudinal direction of the body 201 and isconnected to the second wiring substrate 212 while facing the secondwiring substrate 212.

In this case, a shape of the first wiring substrate 211 is linear beforethe first wring substrate 211 is bent. A maximum width W1 of the firstwiring substrate 211 is smaller than a width W0 of the slit 202 in adirection along a short side (X direction) of the body 201. Here, in thepreviously-described first embodiment, the width W1 of the first wiringsubstrate 211 is larger than the width W0 of the slit 202 because amaximum width of the first wiring substrate 211 includes the bend 213.

Accordingly, the first wiring substrate 211 can be pulled out (extend)through the slit 202 from an inner side of the body 201.

That is, in the previously-described body 201 in FIG. 4, the firstwiring substrate 211 can be extending from an interior the slit 202 tothe outside the slit 202 of the common-chamber substrate 70. Thus, itbecomes possible to join the holding substrate 50 to be joined to theactuator substrate 20 and the common-chamber substrate 70 after passingthe first wiring substrate 211 connected to the actuator substrate 20through the slit 202 of the common-chamber substrate 70.

Thereby, the present embodiment does not have to connect the firstwiring substrate 211 to the actuator substrate 20 after passing thefirst wiring substrate 211 through the slit 202 from outside thecommon-chamber substrate 70. Thus, a large sized common-chambersubstrate 70 served as a frame does not interfere a connection operationof the actuator substrate 20 and the first wiring substrate 211. Thus,the present embodiment improves assembly.

FIG. 7 illustrates the head 404 according to a third embodiment of thepresent disclosure, showing a perspective view of the head 404 accordingto the present embodiment.

In the present embodiment, a flexible printed circuit (FPC) is used forthe second wiring substrate 222. The second wiring substrate 222includes a terminal 224 and is connected to a connector of the hostdevice to receive control signals and power.

FIG. 8 illustrates the head 404 according to a fourth embodiment of thepresent disclosure, showing a perspective view of the head 404 accordingto the present embodiment.

In the present embodiment, the first wiring substrate 211 and the secondwiring substrate 212 are connected by a third wiring substrate 223 thatis different with the first wiring substrate 211 and the second wiringsubstrate 212. The third wiring substrate 223 includes a wiring patternsimilar to the bend 213 of the first wiring substrate 211 in the firstembodiment. A leading end 223 a of the third wiring substrate 223 isbent toward the longitudinal direction of the body 201 and is connectedto the second wiring substrate 212 while facing the second wiringsubstrate 212.

Therefore, the first wiring substrate 211 can be connected to the secondwiring substrate 212 without bending the first wiring substrate 211 asdescribed in the second embodiment while the width of the first wiringsubstrate 211 is a constant value smaller than the width of the slit202.

In this case, the third wiring substrate 223 and the second wiringsubstrate 212 are separately manufactured and joined by, for example, aconnector, an anisotropic conductive film (ACF), non-conductive paste(NCP), a solder connection, metal diffusion bonding, or wire bonding.

The third wiring substrate 223 and the second wiring substrate 212 maybe formed by a rigid flexible substrate (rigid flex substrate) of aflying lead type. The rigid flex substrate is made by integrating arigid substrate and a flexible substrate. This configuration can improveconnection reliability and reduce connection processes.

The fourth embodiment can shorten a length of the first wiring substrate211 connected to the body 201 to be shorter than the length of the firstwiring substrate 211 in the first embodiment. Thus, handling of thefirst wiring substrate 211 improves. Further, a connection process ofthe first wiring substrate 211 and the actuator substrate 20 or anassembly workability of the body 201 improves. Further, shortening thelength of the first wiring substrate 211 makes the first wiringsubstrate 211 easier to pass through the slit 202. Thus, workability isimproved also in this respect.

FIGS. 9 and 10 illustrate the head 404 according to a fifth embodimentof the present disclosure.

FIG. 9 is a perspective view of the head 404 according to the presentembodiment. FIG. 10 is a cross-sectional view of a leading portion ofthe first wiring substrate 211.

In the present embodiment, the first wiring substrate 211 includes abase 211A, a wiring pattern 215, and a protection layer 211B. The wiringpattern 215 is provided on the base 211A and is covered by theprotection layer 211B. A reinforcing plate 231 is provided on an end ofthe first wiring substrate 211 to be connected to the second wiringsubstrate 212.

The reinforcing plate 231 is for reinforcing a terminal portion of thefirst wiring substrate 211. A reinforcing film is used for thereinforcing plate 231, for example. This reinforcing plate 231 isprovided on a surface of the base 211A opposite to a surface on which aterminal 211C of the base 211A is provided. The terminal 211C is anexposed portion of the wiring pattern 215 not covered by the protectionlayer 211B. A thickness of the reinforcing plate 231 is greater than athickness of the protection layer 211B.

The fifth embodiment is otherwise configured the same as the thirdembodiment.

The first wiring substrate 211 is connected to the second wiringsubstrate 222 or the third wiring substrate 223 (other wiring substrate)on a surface opposite to a surface on which the reinforcing plate 231 isprovided. A first distance L1 is from a surface of the first wiringsubstrate 211 on which the first wiring substrate 211 is joined to thesecond wiring substrate 222 to one end of an outer circumference of thebody 201 in the direction along the short side (X direction) of the body201. A second distance L2 is from the surface on which the reinforcingplate 231 is provided to another end of the outer circumference of thebody 201 in the direction along the short side (X direction) of the body201. The first distance L1 is shorter than the second distance L2.

Thereby, a joining tool such as a heater chip can be contact to ajoining portion from one of a closer distance side (first distance L1side) from the outer circumference of the body 201 to the joiningportion of the first wiring substrate 211 and the second wiringsubstrate 212.

Thus, the body 201 and the joining tool do not interface with eachother. Even the joining portion is closed to the body 201 (even aprotruding amount of the first wiring substrate 211 from the body 201 issmall), the first wiring substrate 211 can be joined to the secondwiring substrate 212. Thus, the fifth embodiment can reduce the size ofthe head 404.

FIG. 11 illustrates the head 404 according to a sixth embodiment of thepresent disclosure, showing a perspective view of the head 404 accordingto the present embodiment.

In the present embodiment, a reinforcing plate 231 is provided on an endof the first wiring substrate 211 to be connected to the third wiringsubstrate 223 as shown in the fourth embodiment in FIG. 8.

The first wiring substrate 211 is connected to the third wiringsubstrate 223 that is another wiring substrate on a surface opposite toa surface on which the reinforcing plate 231 is provided. A thirddistance L3 is from a joining surface of the first wiring substrate 211and the third wiring substrate 223 to one end of the outer circumferenceof the body 201 in the longitudinal direction of the body 201. A fourthdistance L4 is from the surface on which the reinforcing plate 231 isprovided to another end of the outer circumference of the body 201. Thethird distance L3 is shorter than the fourth distance L4.

According to such a configuration, it is possible to obtain the samefunctional effect as that of the fifth embodiment.

FIG. 12 illustrates the head 404 according to a seventh embodiment ofthe present disclosure, showing a cross-sectional view of a main portionof the head 404 according to the present embodiment.

The first wiring substrate 211, one end of which is connected to theactuator substrate 20, is bent from the direction along the nozzle face1 a toward a direction perpendicular to the nozzle face 1 a and ispulled out (extends) through the slit 202 of the common-chambersubstrate 70.

Here, an electrical part 504 such as a capacitor is mounted on a sidethat becomes an inner face of the first wiring substrate 211 in a statein which the first wiring substrate 211 is bent. This inner face is notan interior surface of the head 404 but an inner surface of an arc ofthe first wiring substrate 211 formed by bending the first wiringsubstrate 211.

When the first wiring substrate 211 is bent 90 degree in a state inwhich the first wiring substrate 211 is connected to the actuatorsubstrate 20, the first wiring substrate 211 tries to restore to acondition in which the first wiring substrate 211 is straight (not bent)when the first wiring substrate 211 passes through the slit 202 unlessthere is no fold habit on the first wiring substrate 211.

Thus, the electrical part 504 is mounted on a side to be the inner faceof the first wiring substrate 211 in a state in which the first wiringsubstrate 211 is bent. Thus, the electrical part 504 mounted on thefirst wiring substrate 211 is not easily caught by an end of the slit202. Therefore, it becomes easier to pass the first wiring substrate 211through the slit 202.

FIG. 13 illustrates an eighth embodiment of the head 404 according tothe present disclosure, showing a perspective view of the head 404according to the eighth embodiment.

A holder 250 is mounted on the body 201 that discharges the liquid. Theholder 250 holds the first wiring substrate 211, the second wiringsubstrate 212, and the third wiring substrate 223.

The holder 250 holds the first wiring substrate 211 on a side face ofthe holder 250 along the short side of the body 201. The holder 250holds the second wiring substrate 212 on a side face of the holder 250along the longitudinal direction of the body 201. The holder 250 holdsthe third wiring substrate 223 such that a principal surface of thethird wiring substrate 223 overlaps with a surface of the first wiringsubstrate 211. A leading end 223 a of the third wiring substrate 223 isconnected to an outer surface of the second wiring substrate 212 whilefacing the outer surface of the second wiring substrate 212.

The first wiring substrate 211, the second wiring substrate 212, and thethird wiring substrate 223 are mounted (held) on the holder 250 bysecuring with screws, pinching the first wiring substrate 211, thesecond wiring substrate 212, and the third wiring substrate 223 to theholder 250 with clips, or fixing the third wiring substrate 223 to theholder 250 with a double-sided tape or adhesive.

FIG. 14 illustrates the head 404 according to a ninth embodiment of thepresent disclosure, showing a perspective view of the head 404 accordingto the ninth embodiment.

The head 300 includes a body 201 and a liquid supply member 301. Thebody 201 includes a nozzle face 1 a on which a plurality of nozzles 4 todischarge liquid is formed. The liquid supply member 301 includes aliquid supply channel communicating with a common liquid chamber 10interior the body 201 to supply liquid to the common liquid chamber 10.

A second wiring substrate 212 is a print board including a connector 214to be connected to the outside. The second wiring substrate 212 isdisposed along an outer surface of the liquid supply member 301. Theouter surface of the liquid supply member 301 is arranged along alongitudinal direction of the body 201. Further, the second wiringsubstrate 212 stands substantially perpendicular (includingperpendicular) to the nozzle face 1 a of the body 201. This secondwiring substrate 212 is connected to the first wiring substrate 211 viathe third wiring substrate 223. The first wiring substrate 211 isextending from the body 201 from an end portion of the body 201 in alongitudinal direction of the body 201 such that a principal surface ofthe first wiring substrate 211 is disposed along the short side of thebody 201.

FIGS. 15 to 18 illustrate an example of the body according to ninthembodiment of the present disclosure.

FIG. 15 is a perspective view of the body 201. FIG. 16 is across-sectional view of the body 201 along the direction perpendicularto a nozzle array. FIG. 17 is an enlarged cross-sectional view of a mainportion of the body of FIG. 16. FIG. 18 is a cross-sectional view of aportion of the body 201 along the nozzle array.

In FIG. 16, a plurality row of nozzles 4 is arrayed in the nozzle array.For example, there are four rows of nozzle array in FIG. 6. The nozzlearray corresponds to the longitudinal direction Y in FIGS. 1 to 24 ofthe body 201.

The body 201 includes a nozzle plate 1, a channel plate 2, a diaphragm3, piezoelectric elements 11, a holding substrate 50, a first wiringsubstrate 211, a common-chamber substrate 70, and a cover 45. Thediaphragm 3 forms a wall surface of an individual liquid chamber 6. Thepiezoelectric elements 11 serves as a pressure generating elements(pressure generators). The first wiring substrate 211 is a wiring memberincludes a flexible printed circuit (FPC).

Here, an actuator substrate 20 includes a part constituted by thechannel plate 2, the diaphragm 3, and the piezoelectric element 11.

The nozzle plate 1 includes a plurality of nozzles 4 to dischargeliquid. As illustrated in FIG. 27, the nozzles 4 are arrayed in fourrows in a main scanning direction (MSD) to form four nozzle arrays.

With the nozzle plate 1 and the diaphragm 3, the channel plate 2 formsindividual liquid chambers 6 communicating with the nozzles 4, fluidrestrictors 7 communicating with the individual liquid chambers 6, andliquid introduction portions 8 communicating with the fluid restrictors7.

The liquid introduction portions 8 are communicating with the commonliquid chamber 10 formed by the common-chamber substrate 70 via openings9 of the diaphragm 3 and an opening 51 served as a channel of theholding substrate 50.

The diaphragm 3 includes deformable vibration portions 30 forming onewall of the individual liquid chambers 6. The piezoelectric element 11is disposed integrally with the vibration portion 30 on a face of thevibration portion 30 of the diaphragm 3 opposite the individual liquidchamber 6. The vibration portion 30 and the piezoelectric element 11form a piezoelectric actuator.

As illustrated in FIG. 17, in the piezoelectric element 11, a lowerelectrode 13, a piezoelectric layer (piezoelectric body) 12, and anupper electrode 14 are laminated in this order from the vibrationportion 30. An insulation film 21 is formed on the piezoelectric element11.

The lower electrode 13 as a common electrode for the plurality ofpiezoelectric elements 11 is connected to a common-electrodepower-supply wiring pattern 26 via a common wire 15. The lower electrode13 is a single electrode layer formed across entire of the piezoelectricelements 11 in the nozzle array.

The upper electrodes 14 as individual electrodes for the piezoelectricelements 11 are connected to a driver integrated circuit (IC) 500(hereinafter, driver IC 500) as a drive circuit via individual wires 16.The individual wire 16 is covered with an insulation film 22.

The driver IC 500 is mounted on the actuator substrate 20 by a flip-chipbonding method, for example, to cover an area between rows of thepiezoelectric elements 11.

The driver IC 500 mounted on the actuator substrate 20 is connected toan individual-electrode power-supply wiring pattern 25 to which a drivewaveform (drive signal) is supplied.

A wiring pattern provided at the first wiring substrate 211 iselectrically connected to a wiring pattern of the driver IC 500. Theopposite end of the first wiring substrate 211 is connected to thesecond wiring substrate 212 via the third wiring substrate 223 and isfurther connected to a controller mounted to an apparatus body.

The holding substrate 50 covering the piezoelectric element 11 on theactuator substrate 20 is bonded, with adhesive, to one side of theactuator substrate 20 on which the diaphragm 3 is disposed.

The holding substrate 50 includes openings 51, recesses 52, and openings53. The openings 51 serves as a part of channel that communicates thecommon liquid chambers 10 with the individual liquid chambers 6. Therecesses 52 accommodate the piezoelectric elements 11. The openings 53accommodate the driver IC 500. The openings 51 are slit-shaped throughholes extending along the nozzle array and form a part of the commonliquid chamber 10.

The holding substrate 50 is interposed between the actuator substrate 20and the common-chamber substrate 70 to form a part of a wall surface ofthe common liquid chamber 10.

The common-chamber substrate 70 forms the common liquid chamber 10 thatsupplies the liquid to each of the individual liquid chambers 6. Notethat, in the present embodiment, the four common liquid chambers 10 aredisposed corresponding to the four nozzle rows. Desired colors ofliquids are supplied to the respective common liquid chambers 10 via theliquid supply port 71 communicating with the liquid supply member 301.

A damper unit 90 is bonded to the common-chamber substrate 70. Thedamper unit 90 includes a damper 91 and damper plates 92. The damper 91is deformable and forms one wall of the common liquid chamber 10. Thedamper plates 92 reinforce the damper 91.

The common-chamber substrate 70 is bonded to the holding substrate 50and an outer peripheral portion of the nozzle plate 1 with adhesive. Thecommon-chamber substrate 70 accommodates the actuator substrate 20 andthe holding substrate 50, thus forming a frame of this head 404.

The cover 45 is disposed to cover part of a peripheral are of the nozzleplate 1 and part of outer circumferential faces of the common-chambersubstrate 70.

In the body 201, voltage is applied from the driver IC 500 to a portionbetween the upper electrode 14 and the lower electrode 13 of thepiezoelectric element 11. Accordingly, the piezoelectric layer 12expands in an electrode lamination direction (in other words, anelectric-field direction) in which the upper electrode 14 and the lowerelectrode 13 are laminated, and contracts in a direction parallel to thevibration portion 30.

Thus, tensile stress arises at the lower electrode 13 side of thevibration portion 30 facing the lower electrode 13. This tensile stresscauses the vibration portion 30 to bend toward an individual liquidchamber 6 side of the vibration portion 30 facing the individual liquidchamber 6. Accordingly, liquid within the individual liquid chamber 6 ispressurized and discharged from the nozzle 4.

FIGS. 19 to 21B illustrate the head 404 according to a tenth embodimentof the present disclosure.

FIG. 19 is a perspective view of the head 404. FIG. 20A is a plan view,and FIG. 20B is a cross-sectional view along the line A1-A1 in FIG. 20Aof a frame member. FIG. 21A is a plan view, and FIG. 20B is across-sectional view along the line A2-A2 in FIG. 21A of the framemember on which the wiring substrate is disposed.

A frame member 270 of the body 201 includes a slit 271 penetratingthrough the frame member 270 to pull the first wiring substrate 211outside the body 201. The slit 271 forms an opening corresponding to theslit 202 in the first embodiment as illustrated in FIG. 1.

Further, the frame member 270 includes a groove 272 connected to theslit 271. The groove 272 opens to a face opposite the nozzle face 1 a.That is, the groove 272 opens at a side of the frame member 270 fromwhich the first wiring substrate 211 is pulled out (extends). In FIGS.20A and 21A, a region corresponding to the groove 272 is chamfered.

The groove 272 is formed of a longitudinal portion 272 a and a shortportion 272 b. The longitudinal portion 272 a extends in a longitudinaldirection of the body 201, and the short portion 272 b extends in ashort side of the body 201. The groove 272 has L-shape in a plan viewviewed from upper face side of the frame member 270 by connecting thelongitudinal portion 272 a and the short portion 272 b.

The first wiring substrate 211 is pulled (extends) outside the body 201through the slit 271.

As illustrated in FIG. 21A, a principal surface of the third wiringsubstrate 223 is bent from a direction along the short side (indicatedby the arrow X) of the body 201 to a direction along the longitudinaldirection (indicated by the arrow Y) of the body 201. The third wiringsubstrate 223 is disposed across the short portion 272 b and thelongitudinal portion 272 a. Thus, the third wiring substrate 223includes a bending portion 223 b at which the principal surface of thethird wiring substrate 223 is bent from a direction along the short side(indicated by the arrow X) of the body 201 to a direction along thelongitudinal direction (indicated by the arrow Y) of the body 201. Thebending portion 223 b is disposed interior the groove 272.

A principle surface of the second wiring substrate 212 is disposed alonga longitudinal direction of the body 201. Further, the second wiringsubstrate 212 stands perpendicular to the nozzle face 1 a of the body201.

One terminal group of the first wiring substrate 211 is disposed outsidethe body 201 and is electrically connected to one terminal group of thethird wiring substrate 223 at outside the body 201 with a solderconnection or an anisotropic conductive film (ACF), for example. Aconnecting portion between the first wiring substrate 211 and the thirdwiring substrate 223 is referred to as an electrical connecting portion232.

Another terminal group of the third wiring substrate 223 and theterminal group of the second wiring substrate 212 is electricallyconnected with a solder connection, for example. A connecting portionbetween the third wiring substrate 223 and the second wiring substrate212 is referred to as an electrical connecting portion 233. A part ofthe electrical connecting portion 233 is disposed interior thelongitudinal portion 272 a. Thus, each of the part of the second wiringsubstrate 212 and the third wiring substrate 223 is disposed interiorthe groove 272.

In this way, the tenth embodiment can lower a height of the secondwiring substrate 212 including a height of the electrical connectingportion 233 of the second wiring substrate 212 and the third wiringsubstrate 223. Thus, a protruding amount of the second wiring substrate212 from the frame member 270 can be reduced. Therefore, the tenthembodiment can reduce the whole size of the head 404 in a heightdirection.

Further, the part of the third wiring substrate 223 is accommodatedinterior the short portion 272 b. Thus, the wiring pattern of the thirdwiring substrate 223 overlaps with the first wiring substrate 211 in theheight direction. As illustrated in FIGS. 19 and 21B, the wiring patternof the third wiring substrate 223 is disposed lower than a leading end211 a of the first wiring substrate 211 in a height direction of thebody 201.

Therefore, the tenth embodiment can reduce the whole size of the head404 in a height direction in this respect.

The present embodiment has an effect such that the short portion 272 bguides the third wiring substrate 223 when the third wiring substrate223 is bent to be joined to the first wiring substrate 211 because thethird wiring substrate 223 is disposed across the longitudinal portion272 a and the short portion 272 b.

That is, it becomes easier to electrically connect (join) the thirdwiring substrate 223 to the first wiring substrate 211 by bending thethird wiring substrate 223 along the short portion 272 b while disposingthe third wiring substrate 223 that is previously connected to thesecond wiring substrate 212 in the longitudinal portion 272 a.

FIGS. 22A through 23B illustrate the head 404 according to an eleventhembodiment of the present disclosure.

FIG. 22A is a plan view, and FIG. 22B is a cross-sectional view alongthe line A3-A3 in FIG. 22A of a frame member. FIG. 23A is a plan view,and FIG. 23B is a cross-sectional view along the line A4-A4 in FIG. 23Aof the frame member on which the wiring substrate is disposed.

The eleventh embodiment includes a groove 272 that does not include theshort portion 272 b in the tenth embodiment, and includes only thelongitudinal portion 272 a in the tenth embodiment.

Here, the bending portion 223 b of the third wiring substrate 223 to beelectrically connect to the second wiring substrate 212 is disposedinterior the groove 272 (longitudinal portion 272 a). Another portion ofthe third wiring substrate 223 is disposed interior the slit 271 asillustrated in FIGS. 23A and 23B.

Even configuring the body 201 in this way, the eleventh embodiment canlower the height of the second wiring substrate 212 including the heightof the electrical connecting portion 233 of the second wiring substrate212 and the third wiring substrate 223. Thus, a protruding amount of thesecond wiring substrate 212 from the frame member 270 can be reduced.Therefore, the eleventh embodiment can reduce the whole size of the head404 in a height direction. Further, even configuring the body 201 inthis way, the wiring pattern of the third wiring substrate 223 is lowerthan the leading end 211 a of the first wiring substrate 211 in theheight direction. Therefore, the eleventh embodiment can reduce thewhole size of the head 404 in a height direction in this respect.

FIG. 24 illustrates the head 404 according to a twelfth embodiment ofthe present disclosure, showing a perspective view of the head 404.

In the present embodiment, the first wiring substrate 211 and the thirdwiring substrate 223 are joined in a state in which a leading end 211 aof the first wiring substrate 211 extending from the slit 271 of theframe member 270 is folded (bent) back to the slit 271 side.

That is, in case a long wiring substrate is used as the first wiringsubstrate 211, a position of the terminal group on a leading end 211 aof the first wiring substrate 211 and a position of the terminal groupof the third wiring substrate 223 may not match in a height direction ifthe first wiring substrate 211 is just extending from the slit 271 ofthe frame member 270.

Thus, the position of the terminal group on the leading end 211 a of thefirst wiring substrate 211 can be adjusted with the position of theterminal group of the third wiring substrate 223 by folding the leadingend 211 a of the first wiring substrate 211 extending from the slit 271back toward the slit 271. Thereby, the terminal group of the firstwiring substrate 211 and the terminal group of the third wiringsubstrate 223 can be joined and electrically connected after adjustingthe height of each terminal group.

FIGS. 25 and 26 illustrate an example of a liquid discharge apparatus600 according to the present embodiment.

FIG. 25 is a plan view of a main part of the liquid discharge apparatus600. FIG. 26 is a side view of a portion of the liquid dischargeapparatus 600.

The liquid discharge apparatus 600 is a serial-type apparatus in which adrive unit 493 reciprocally moves a carriage 403 in a main scanningdirection indicated by arrow MSD in FIG. 25. The drive unit 493 includesa guide 401, a main scanning motor 405, a timing belt 408, for example.The guide 401 is laterally bridged between a left side plate 491A and aright side plate 491B and supports the carriage 403 so that the carriage403 is movable along the guide 401. The main scanning motor 405reciprocally moves the carriage 403 in the main scanning direction MSDvia the timing belt 408 laterally bridged between a drive pulley 406 anda driven pulley 407.

The carriage 403 mounts a liquid discharge device 440 in which the head404 according to the present embodiment and a head tank 441 areintegrated into a single unit. The head 404 of the liquid dischargedevice 440 discharges color liquids of, for example, yellow (Y), cyan(C), magenta (M), and black (K). The head 404 includes nozzle arrays,each including a plurality of nozzles four arrayed in row in asub-scanning direction indicated by arrow SSD in FIGS. 25 and 26. Thesub-scanning direction (SSD) is perpendicular to the main scanningdirection MSD. The head 404 is mounted to the carriage 403 so that inkdroplets are discharged downward.

The main scanning direction MSD illustrated in FIGS. 25 and 27corresponds to the short side X in FIGS. 1 and 2 of the body 201, andthe sub-scanning direction SSD illustrated in FIGS. 25 and 27corresponds to the longitudinal direction Y in FIGS. 1 to 24 of the body201.

The liquid stored outside the head 404 is supplied to the head 404 via asupply unit 494 that supplies the liquid from a liquid cartridge 450 tothe head tank 441. The supply unit 494 includes, e.g., a cartridgeholder 451 as a mount to mount a liquid cartridge 450, a tube 456, and aliquid feed unit 452 including a liquid feed pump. The liquid cartridge450 is detachably attached to the cartridge holder 451. The liquid issupplied to the head tank 441 by the liquid feed unit 452 via the tube456 from the liquid cartridge 450.

The liquid discharge apparatus 600 includes a conveyance unit 495 toconvey a sheet 410. The conveyance unit 495 includes a conveyance belt412 as a conveyor and a sub-scanning motor 416 to drive the conveyancebelt 412.

The conveyance belt 412 attracts the sheet 410 and conveys the sheet 410at a position facing the head 404. The conveyance belt 412 is in theform of an endless belt. The conveyance belt 412 is stretched between aconveyance roller 413 and a tension roller 414. The sheet 410 isattracted to the conveyance belt 412 by electrostatic force or airsuction.

The conveyance roller 413 is rotated by a sub-scanning motor 416 via atiming belt 417 and a timing pulley 418, so that the conveyance belt 412circulates in a sub-scanning direction indicated by arrow SSD in FIGS.25 and 26.

At one side in the main scanning direction MSD of the carriage 403, amaintenance unit 420 to recover the head 404 in good condition isdisposed on a lateral side (right-hand side) of the conveyance belt 412in FIG. 25.

The maintenance unit 420 includes, for example, a cap 421 to cap thenozzle face (i.e., a face on which the nozzles are formed) la of thehead 404 and a wiper 422 to wipe the nozzle face 1 a.

The drive unit 493, the supply unit 494, the maintenance unit 420, andthe conveyance unit 495 are mounted to a housing 491 that includes theleft side plate 491A, the right side plate 491B, and a rear side plate491C.

In the liquid discharge apparatus 600 thus configured, a sheet 410 isconveyed on and attracted to the conveyance belt 412 and is conveyed inthe sub-scanning direction SSD by the cyclic rotation of the conveyancebelt 412.

The head 404 is driven in response to image signals while the carriage403 moves in the main scanning direction MSD, to discharge liquid to thesheet 410 stopped, thus forming an image on the sheet 410.

As described above, the liquid discharge apparatus 600 includes the head404 according to the present embodiment, thus allowing stable formationof high quality images.

FIG. 27 illustrates another example of the liquid discharge device 440according to another embodiment of the present disclosure, showing aplan view of a main part of the liquid discharge device 440.

The liquid discharge device 440A includes the housing 491, the driveunit 493, the carriage 403, and the head 404 among components of theliquid discharge apparatus 600. The left side plate 491A, the right sideplate 491B, and the rear side plate 491C constitutes the housing 491.

Note that, in the liquid discharge device 440A, at least one of themaintenance unit 420 and the supply unit 494 described above may bemounted on, for example, the right side plate 491B.

FIG. 28 illustrates still another example of the liquid discharge device440B according to an embodiment of the present disclosure, showing afront view of the liquid discharge device 440B.

The liquid discharge device 440B includes the head 404 to which achannel part 444 as a liquid supply member is mounted, and the tube 456connected to the channel part 444.

Further, the channel part 444 is disposed interior a cover 442. Insteadof the channel part 444, the liquid discharge device 440B may includethe head tank 441. A connector 443 to electrically connect the head 404to a power source is disposed above the channel part 444.

In the present disclosure, discharged liquid is not limited to aparticular liquid as long as the liquid has a viscosity or surfacetension to be discharged from a head. However, preferably, the viscosityof the liquid is not greater than 30 mPa·s under ordinary temperatureand ordinary pressure or by heating or cooling.

Examples of the liquid include a solution, a suspension, or an emulsionincluding, for example, a solvent, such as water or an organic solvent,a colorant, such as dye or pigment, a functional material, such as apolymerizable compound, a resin, or a surfactant, a biocompatiblematerial, such as DNA, amino acid, protein, or calcium, and an ediblematerial, such as a natural colorant.

Such a solution, a suspension, or an emulsion can be used for, e.g.,inkjet ink, surface treatment solution, a liquid for forming componentsof electronic element or light-emitting element or a resist pattern ofelectronic circuit, or a material solution for three-dimensionalfabrication.

Examples of an energy source for generating energy to discharge liquidinclude a piezoelectric actuator (a laminated piezoelectric element or athin-film piezoelectric element), a thermal actuator that employs athermoelectric conversion element, such as a heating resistor (element),and an electrostatic actuator including a diaphragm and opposedelectrodes.

“The liquid discharge device” is an integrated unit including the headand a functional part(s) or unit(s), and is an assembly of partsrelating to liquid discharge. For example, “the liquid discharge device”may be a combination of the head with at least one of a head tank, acarriage, a supply unit, a maintenance unit, and a drive unit.

Herein, the terms “integrated” or “united” mean fixing the head and thefunctional parts (or mechanism) to each other by fastening, screwing,binding, or engaging and holding one of the head and the functionalparts movably relative to the other. The head may be detachably attachedto the functional part(s) or unit(s) each other.

For example, the head and a head tank may be integrated to form theliquid discharge device. The head and the head tank may be connectedwith each other via, e.g., a tube to integrally form the liquiddischarge device. Here, a unit including a filter may further be addedto a portion between the head tank and the head.

The liquid discharge device may be an integrated unit in which a head isintegrated with a carriage to form a single integrated unit.

The liquid discharge device may be a head movably held by a guide thatforms part of a drive unit, so that the head and the drive unit areintegrated into a single unit. The liquid discharge device may includethe head, the carriage, and the drive unit that are integrated into asingle unit.

In another example, the cap that forms part of the maintenance unit maybe secured to the carriage mounting the head so that the head, thecarriage, and the maintenance unit are integrated into a single unit toform the liquid discharge device.

Further, the liquid discharge device may include tubes connected to thehead mounted on the head tank or the channel member so that the head andthe supply unit are integrated into a single unit. Liquid is suppliedfrom a liquid reservoir source such as liquid cartridge to the headthrough the tube.

The drive unit may be a guide only. The supply unit may be a tube(s)only or a mount (loading unit) only.

The term “liquid discharge apparatus” used herein also represents anapparatus including the head or the liquid discharge device to dischargeliquid by driving the head. The liquid discharge apparatus may be, forexample, an apparatus capable of discharging liquid to a material towhich liquid can adhere or an apparatus to discharge liquid toward gasor into liquid.

The “liquid discharge apparatus” may include devices to feed, convey,and eject the material on which liquid can adhere. The liquid dischargeapparatus may further include a pretreatment apparatus to coat atreatment liquid onto the material, and a post-treatment apparatus tocoat a treatment liquid onto the material, on which the liquid has beendischarged.

The “liquid discharge apparatus” may be, for example, an image formingapparatus to form an image on a sheet by discharging ink, or athree-dimensional fabricating apparatus to discharge a fabricationliquid to a powder layer in which powder material is formed in layers,to form a three-dimensional fabrication object.

In addition, “the liquid discharge apparatus” is not limited to such anapparatus to form and visualize meaningful images, such as letters orfigures, with discharged liquid. For example, the liquid dischargeapparatus may be an apparatus to form meaningless images, such asmeaningless patterns, or fabricate three-dimensional images.

The above-described term “material on which liquid can be adhered”represents a material on which liquid is at least temporarily adhered, amaterial on which liquid is adhered and fixed, or a material into whichliquid is adhered to permeate.

Examples of the “medium on which liquid can be adhered” includerecording media, such as paper sheet, recording paper, recording sheetof paper, film, and cloth, electronic component, such as electronicsubstrate and piezoelectric element, and media, such as powder layer,organ model, and testing cell. The “medium on which liquid can beadhered” includes any medium on which liquid is adhered, unlessparticularly limited.

Examples of “the material on which liquid can be adhered” include anymaterials on which liquid can be adhered even temporarily, such aspaper, thread, fiber, fabric, leather, metal, plastic, glass, wood, andceramic.

“The liquid discharge apparatus” may be an apparatus to relatively movea head and a medium on which liquid can be adhered. However, the liquiddischarge apparatus is not limited to such an apparatus. For example,the liquid discharge apparatus may be a serial head apparatus that movesthe head or a line head apparatus that does not move the head.

Examples of “the liquid discharge apparatus” further include a treatmentliquid coating apparatus to discharge a treatment liquid to a sheetsurface to coat the sheet surface with the treatment liquid to reformthe sheet surface and an injection granulation apparatus to eject acomposition liquid including a raw material dispersed in a solution froma nozzle to mold particles of the raw material.

The terms “image formation”, “recording”, “printing”, “image printing”,and “fabricating” used herein may be used synonymously with each other.

Numerous additional modifications and variations are possible in lightof the above teachings. It is therefore to be understood that, withinthe scope of the above teachings, the present disclosure may bepracticed otherwise than as specifically described herein. With someembodiments having thus been described, it is obvious that the same maybe varied in many ways. Such variations are not to be regarded as adeparture from the scope of the present disclosure and appended claims,and all such modifications are intended to be included within the scopeof the present disclosure and appended claims.

What is claimed is:
 1. A liquid discharge head comprising: a bodyincluding a nozzle face in which a plurality of nozzles is formed todischarge liquid; a first wiring substrate extending from the body; anda second wiring substrate electrically connected to the first wiringsubstrate, wherein the second wiring substrate is disposed along adirection perpendicular to the nozzle face of the body, wherein aprincipal surface of the second wiring substrate is disposed along alongitudinal direction of the body, and wherein the first wiringsubstrate includes: a terminal disposed on a first surface of a leadingend of the first wiring substrate, the terminal being electricallyconnected to the second wiring substrate, and a reinforcing platedisposed on a second surface of the leading end of the first wiringsubstrate opposite the first surface of the leading end of the firstwiring substrate on which the terminal is disposed.
 2. The liquiddischarge head according to claim 1, wherein a first distance from thefirst surface of the leading end of the first wiring substrate on whichthe terminal is disposed to a first end of an outer circumference of thebody in a direction along a short side of the body is shorter than asecond distance from the second surface of the leading end of the firstwiring substrate on which the reinforcing plate is provided to a secondend of the outer circumference of the body in the direction along theshort side of the body.
 3. The liquid discharge head according to claim1, wherein the first wiring substrate is a flexible wiring board, andthe second wiring substrate is a printed circuit board.
 4. The liquiddischarge head according to claim 1, wherein the first wiring substrateincludes: a base, a wiring pattern on the base, and a protection layerto cover the wiring pattern, and wherein a thickness of the reinforcingplate is greater than a thickness of the protection layer.
 5. The liquiddischarge head according to claim 1, wherein a reinforcing film is usedfor the reinforcing plate.
 6. The liquid discharge head according toclaim 1, wherein the body comprises a frame member, the frame memberincluding a groove having an opening on a surface of the frame memberopposite the nozzle face, the groove extending in a longitudinaldirection of the body, and the groove accommodates at least a part ofthe second wiring substrate.
 7. A liquid discharge device comprising theliquid discharge head according to claim
 1. 8. The liquid dischargedevice according to claim 7, further comprising at least one of: a headtank to store the liquid to be supplied to the liquid discharge head, acarriage to mount the liquid discharge head, a supply unit to supply theliquid to the liquid discharge head, a maintenance unit to maintain theliquid discharge head, and a drive unit to move the carriage in a mainscanning direction, to be integrated with the liquid discharge head as asingle unit.
 9. A liquid discharge apparatus comprising: the liquiddischarge device according to claim 7; and a conveyor to convey a mediumto the liquid discharge head, wherein the liquid discharge devicedischarges the liquid to the medium from the plurality of nozzles of theliquid discharge head.